Columbus™
Wafer Nanotopography
Measurement System™
For Wafer Metrology

The Columbus™ Wafer Nanotopography Measurement System™ is WaveFront Sciences' first instrument for the semiconductor industry. It is based on WaveFront
Sciences' success applying Shack-Hartmann technology
in other high tech industries. Specifically designed to address wafer metrology needs for advanced IC manufacture, Columbus™ provides high precision wafer geometry measurements for standard and advanced unpatterned wafers including shape, flatness, nanotopography, and edge roll off. Unique features of
this tool include lithography-relevant wafer flatness,
CMP-relevant nanotopography measurement to the wafer edge, edge profiling (edge roll off), the ability to measure both single- and double-side polished wafers, and the combination of these multiple functions in a single tool. Film stress on pattened and unpattened wafers and SOI qualification via reflectance have recently been added to the suit of Columbus™ measurements.

Applications include but are not limited to:

• Nanotopography
• Optical Flatness Metrology of Polished Silicon Wafers
• Edge Roll Off Characterization
• Silicon-on-Insulator (SOI) Wafer Measurement and Inspection
• EPI Reactor Tune up and Film Stress Measurement
• Lithography Chucks and their Characterization
• Real-time CMP Metrology
• In-situ Flatness Metrology for Lithography Tools
• Chemical-mechanical Polishing (CMP) Dishing of Low K Dielectrics
• Micro-electro-mechanical System (MEMS) testing
• Extreme Ultraviolet (EUV) Aerial Image Monitor (AIM) for Mask Inspection
• EUV Alignment Sensors

Click below for a related Columbus™ paper:
High-Speed Non-Interferometric Nanotopographic Characterization of Si Wafer Surfaces